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www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 1 / 19 02.mar.2012 rev.001 tsz22111 ? 14 ? 001 datasheet 4.5v to 5.5v, 3.0a 1ch s ynchronous buck converter integrated fet b d9134muv general description rohms high efficiency step - down switching regulator bd9134 muv is a power supply designed to produce 3.3 volts from 5 volts power supply line. offers high ef ficiency with our original pulse skip control technology and synchronous rectifier. employs a current mode control system to provide faster transient response to sudden change in load. ? offers fast transient response with current mode pwm contr ol system. ? offers highly efficiency for all load range with synchronous rectifier (nch/ n ch fet) and sllm tm (simple light load mode) ? incorporates soft - start function. ? incorporates thermal protection and uv l o functions. ? incorporates short - current prot ection circuit with time delay function. ? incorporates shutdown function ? i nput voltage range: 4.5 v to 5.5 v ? o utput voltage range: 3. 3v t 0.05v ? o utput current: 3. 0a(max.) ? switching frequency: 1 mhz(typ.) ? high side fet on resistance: 82m (typ.) ? low side fet on resistance: 70m (typ.) ? s tandby current: 0a (typ.) ? o perating temperature range : - 40 to + 10 5 package (typ.) (typ.) (max.) vqfn020v4040: 4.00mm x 4.00mm x 1.00mm applications p ower supply for lsi including dsp, micro computer and asic typical application circuit fig. 1 typical application c ircuit product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays. vqfn020v4040
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 2 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet pin configuration (top view) pin no. pin name function pin no. pin name function 1 sw sw pin 11 gnd ground 2 sw sw pin 12 vout output voltage detect pin 3 sw sw pin 13 ith gmam p output pin/connected phase compensation capacitor 4 sw sw pin 14 n.c. non connection 5 sw sw pin 15 n.c. non connection 6 pvcc highside fet source pin 16 n.c. non connection 7 pvcc highside fet source pin 17 en enable pin(high active 8 pvcc highsid e fet source pin 18 pgnd lowside fet source pin 9 bst bootstrapped voltage input pin 19 pgnd lowside fet source pin 10 vcc vcc power supply input pin 20 pgnd lowside fet source pin block diagram fig. 3 block diagram output pgnd gnd gm amp r s q osc uvlo tsd + v cc v cc clk slope en current comp soft start current sense/ protect + driver logic + vref ith vout r ith c ith pv cc sw pv cc bst v cc 5v input scp pvcc fig. 2 pin configuration 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 n.c. sw pgnd gnd ith n.c. bst vcc vout en
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 3 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet absol ute maximum ratings (ta=25 parameter symbol limits unit v cc voltage v cc - 0.3 to +7 * 1 v pv cc voltage pv cc - 0.3 to +7 * 1 v bst voltage v bst - 0.3 to +13 v bst_sw voltage v bst - sw - 0.3 to +7 v en voltage v en - 0.3 to +7 v sw,ith voltage v sw , v ith - 0.3 to +7 v power dissipation 1 pd1 0.34 * 2 w power dissipation 2 pd2 0.70 * 3 w power dissipation 3 pd3 1.21 * 4 w power dissipation 4 pd4 3.56 * 5 w operating temperature range topr - 40 to +105 storage temperature range tstg - 55 to +150 maximum junctio n temperature tjmax +150 *1 pd should not be exceeded . *2 ic only *3 1 - layer . mounted on a 74.2mm 74.2mm 1.6mm glass - epoxy board, occupied area by copper foil : 10.29mm 2 *4 4 - layer . mounted on a 74.2mm 74.2mm 1.6mm glass - epoxy board, occupie d area by copper foil : 10.29mm 2 , i n each layers *5 4 - layer . mounted on a 74.2mm 74.2mm 1.6mm glass - epoxy board, occupied area by copper foil : 5505mm 2 , i n each layers (ta= - 40 to +105 ) parameter symbol limits unit m in. typ. max. power supply voltage v cc 4.5 5 5.5 v pv cc 4.5 5 5.5 v en voltage ven 0 - 5.5 v output current i sw - - 3 .0* 6 a *6 pd should not be exceeded . (ta=25 v cc =pv cc =5v, en=v cc , unless otherwise specified. ) par ameter symbol limits unit conditions min. typ. max. standby current i stb - 0 10 a cc - 250 500 a enl - gnd 0.8 v standby mode en high voltage v enh 2.0 vcc - v active mode en input current i en - 1 10 a e n =5v oscillation frequency f osc 0.8 1 1.2 mhz high side fet on resistance r onh - 82 115 m cc =5v low side fet on resistance r onl - 70 98 m cc =5v output voltage v out 3.25 3.3 3.35 v ith si nk current i thsi 10 18 - a out =4.1v ith s ource c urrent i thso 10 18 - a out =2.5v uvlo threshold voltage v uvlo 1 3.6 3.8 4.0 v v cc =5v uvlo 2 3.65 3.9 4.2 v v cc =0v ss 2.5 5 10 ms timer latch time t latch 0.5 1 2 ms output short circuit threshold voltage v scp - 1 .65 2.4 v v out =3.3v
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 4 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet typical performance curves fig.7 ta - vout fig.4 vcc - vout fig.5 ven - vout fig.6 iout - vout
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 5 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet fi g.8 efficiency fig. 10 ta C
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 6 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet fig.12 ta - icc fig.13 vcc - fosc fig.14 soft start waveform fig.15 sw waveform io=10ma
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 7 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet fig.1 6 sw waveform io=3a fig.1 8 transient response io=3 s) 3a(10s)
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 8 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet application information operation bd9134muv is a synchronous rectifying step - down switching regulator that achieves faster transient response by employing current mode pwm c ontrol system. it utilizes switc hing operation in pwm (pulse width modulation) mode for heavier load, while it utilizes sllm tm (simple light load mode) operation for lighter load to improve efficiency. synchronous rectifier it does not require the power to be dissipated by a rectifier externally connected to a conventional dc/dc converter ic, and its p . n junction shoot - through protection circuit limits the shoot - through current during operation, by which the power dissipation of the set is reduced. current mode pwm control synthesize s a pwm control signal with a inductor current feedback loop added to the voltage feedback. ? pwm (pulse width modulation) control the oscillation frequency for pwm is 1 mhz. set signal form osc turns on a highside mos fet (while a lowside mos fet is turne d off), and a n inductor current i l increases. the current comparator (current comp) receives two signals, a current feedback control signal (sense: voltage converted from i l ) and a voltage feedback control signal (fb), and issues a reset signal if both in put signals are identical to each other, and turns off the highside mos fet (while a lowside mos fet is turned on) for the rest of the fixed period. the pwm control repeat this operation. ? sllm tm (simple light load mode) control when the control mode is shifted from pwm for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn off with the device held operated in normal pwm control loop, which allow s linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. although the pwm control loop continues to operate with a set signal from osc and a reset signal from curr ent comp, it is so designed that the reset signal is held issued if shifted to the light load mode, with which the switching is tuned off and the switching pulses are thinned out under control. activating the switching intermittently reduces the switching dissipation and improves the efficiency. fig.19 diagram of current mode pwm control osc level shift driver logic r q s i l sw ith current comp gm amp. set reset fb load v out v out fig.20 pwm switching timing chart fig. 2 1 s llm tm switching timing chart current comp set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb current comp set reset sw v out pvcc gnd gnd gnd 0a v out (ave) sense fb i l not switching i l
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 9 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet description of operations ? soft - start function en terminal shifted to high activates a soft - starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ? shutdown function with en terminal shifted to low, the device turns to standby mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to off. circuit current during standby is 0a (typ.). ? uvlo function detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 50 mv (typ.) is provided to prevent output chattering. fig.22 soft start, shut down, uvlo timing chart ? short - current protection circuit with time delay function turns off the output to protect the ic from breakdown when the incorporated current limiter is activated continuously for the fixed time ( t latch ) or more . the output thus held tuned off may be recovered by restarting en or by re - unlocking uvlo. fig.23 short - current protection circuit with time delay timing chart hysteresis 50mv tss tss tss soft start standby mode operating mode standby mode operating mode standby mode operating mode standby mode uvlo en uvlo uvlo v cc en v out 1/2v out 1msec outp ut voltage off latch output current in non - control output current in control by limit value (with fall of the output voltage, limit value goes down) en timer latch en standby mode operated mode standby mode operated mode en v out limit i l until output voltage goes up the half of vo or over, timer latch is not operated. (no timer latch, only limit to the output current)
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 10 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet info rmation on advantages advantage 1 offers fast transient response with current mode control system. voltage drop due to sudden change in load was reduced by about 5 0%. fig. 2 4 comparison of transient response advantage 2 offers high efficiency for all load range. ? for lighter load : utilizes the current mode control mode called sllm tm for lighter load, which reduces various dissipation such as switching dissipation (p sw ), gate charge/discharge dissipation, esr dissipation of output capacitor (p esr ) and on - resistance dissipation (p ron ) that may otherwise cause degradation in efficiency for lighter load. achieves efficiency improvement for lighter load. ? for heavier load : utilizes the synchronous rectifying mode and the low on - resistance mos fe ts incorporated as power transistor. o n resistance of highside mos fet : 82m(typ.) on resistance of lowside mos fet : 70m(typ.) achieves efficiency improvement for heavier load. offers high efficiency for all load range with the improvement s mentioned above. fig. 2 5 efficiency bd9134muv ( load response i o =1a 0.001 0.01 0.1 1 0 50 100 pwm sllm tm inprovement by sllm tm system improvement by synchronous rectifier efficiency [%] output current io[a] conventional product ( load response i o =1a v out i out 572mv v out i out 328mv
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 11 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet advantage 3 ? supplied in smaller package due to small - sized p ower mos fet incorporated. reduces a mounting area required. fig.26 example application switching regulator efficiency efficiency ? may be expressed by the equation shown below: efficiency may be improved by reducing the switching regulator power dissipation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet pd(i 2 r) 2) gate charge/discharge dis sipation pd(gate) 3) switching dissipation pd(sw) 4) esr dissipation of capacitor pd(esr) 5) operating current dissipation of ic pd(ic) 1)pd(i 2 r)=i out 2 (r coil +r on ) (r coil [ ] d c resistance of inductor , r on [ ] on resistance of fet , i out [a] output current. ) 2)pd(gate)=cgs f v 2 (cgs[f] gate capacitance of fet f[h] switching frequency v[v] gate driving voltage of fet ) 4)pd(esr)=i rms 2 esr (i rms [a] ripple current of capacitor esr[ ] equivalent series resistance. ) 5)pd(ic)=vin i cc (i cc [a] circuit curre nt. ) ? output capacitor co required for current mode control: 22 f ceramic capacitor ? inductance l required for the operating frequency of 1 mhz: 2.2 h inductor ? incorporates fet + boot strap diode v cc output pgnd gnd gm amp r s q osc uvlo tsd + vc c clk slope en current comp soft start current sense/ protect + driver logic + vref ith vout r ith c ith pvcc sw pvcc bst vcc 3.3v input scp 15mm 20mm r 2 c ith c f co l r 1 r ith rf c bst c in = v out i out vin iin 100[% ] = p out pin 100[% ] = p out p out +p d 100[% ] vin 2 c rss i out f i drive 3)pd(sw)= ( c rss [ f] reverse transfer capacitance of fet i drive [a] peak current of gate. )
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 12 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet consideration on permissible dissipation and heat generation as this ic functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losses du e to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. p=i out 2 r on r on =d r onp +(1 - d)r onn d on duty (=v out /v cc ) r onh on resistance of highside mos fet r onl on resistance of lowside mos fet i out output current if v cc =5v, v out =3 .3v , r onh =82m , r onl =70m i out =3a, for example, d=v out /v cc =3.3/5.0=0.66 r on =0.66 0.082+(1 - 0.66) 0.07 =0.05412+0.0238 =0.07792[ ] p=3 2 0.07792 0.70128[w] as r on h is greater than r on l in this ic, the dissipation increases as the on duty becomes greater. wi th the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. fig.27 thermal derating curve (vqfn020v4040) power dissipation:pd [w] ambient temperature:t a [ ] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 1.21w 3.56w 1.0 0.70w 0.34w 2 ) copper foil in each layers. 4 layers (copper foil area : 10.29m 2 ) copper foil in each layers. j 2 ) j 105
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 13 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet selection of components externally connected 1. selection of inductor (l) * current exceeding t he current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. t he inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. if v cc =5.0v, v out =3.3v, f=1mhz, i l =0.2 3a=0.6a , for example, (bd9134muv) * select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better efficiency. 2. selection of output capacitor (c o ) 3. sele ction of input capacitor (cin) a low esr 22 f/10v ceramic capacitor is recommended to reduce esr dissipation of input capacitor for better efficiency. the inductance significantly depends on output ripple current. as seen in the equation (1), the ripple current decreases as the inductor a nd/or switching frequency increases. l = (v cc - v out ) out l cc ??? l =0.2 out max. [a] ??? cc - v out ) out l cc ??? l : output ripple current, and f: switching frequency ) output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. output ripple voltage is determined by the equation (4) out = l ??? l : output ripple current , esr: equivalent series resistance of output capacitor ) output voltage. a 22f to 100f ceramic capacitor is recommended. i l v out fig.28 output ripple current i l v cc il l co v cc l co v out esr input capacitor to select must be a low esr cap acitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current i rms is given by the equation ( 5 ): i rms =i out out (v cc - v out ) v cc [a] ??? out , i rms = i out 2 < worst case > i rms(max.) i rms =3 rms ] v out v cc l co cin if v cc =5v, v out =3.3v, and i outmax.= 3a, (bd9134muv)
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 14 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet 4. determination of r ith , c ith that works as a phase compensator as the current mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described below to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min.) produced by the output capacitor and the load resi stance with cr zero correction by the error amplifier. gain [db] phase [deg] fig. 3 1 open loop gain characteristics a 0 0 - 90 a 0 0 - 90 fz(amp.) fig.32 error amp phase compensation characteristics fp= 2 r o c o 1 fz (esr) = 2 e sr c o 1 pole at power amplifier when the output current decreases, the load resistance ro increases and the pole frequency lowers. fp (min.) = 2 r omax. c o 1 [hz] with lighter load fp (max.) = 2 r omin. c o 1 [hz] with heavier load zero at power amplifier fz (amp.) = 2 r ith c ith 1 fp(min.) fp(max.) fz(esr) i out min. i o ut max. gain [db] phase [deg] increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacitor esr reduces to half.) fz(amp.)= fp(min.) 2 r ith c ith 1 = 2 r omax. c o 1 fig.33 typ ical application gnd,pgnd sw pv cc en adj ith v cc v out cin r ith c ith l esr c o r o v out c bst v cc c f r f
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 15 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet cautions on pc board layout fig.34 layout diagram lay out the input ceramic capacitor c in closer to the pins pv cc and pgnd, and the output capacitor c o closer to the pin pgnd. lay out c ith and r ith between the pins ith and gnd as neat a s possible with least necessary wiring. vqfn020v4040 (bd9134muv) has thermal pad on the reverse of the package. the package thermal performance may be enhanced by bonding the pad to gnd plane which take a large area of pcb. recommended components lis ts on above application symbol part value manufacturer series l coil 2.0h s umida cdr6d28mnp - 2r0nc 2.2h s umida cdr6d26np - 2r2nc c in ceramic capacitor 22f murata grm32eb11a226ke20 c o ceramic capacitor 22f murata grm31cb30j226ke18 c ith ceramic capac itor 1500pf murata grm1 8 serise r ith resistance 5.1k rohm mcr03 serise cf ceramic capacitor 1000 pf murata g rm 18 serise rf resistance 10 rohm mcr03 serise *the parts list presented above is an example of recommended parts. although the parts are sound, actual circuit characteristics should be chec ked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and this ic when employing the depicted circuit with other circuit constants modified. both static and transient characteri stics should be considered in establ ishing these margins. when switching noise is substantial and may impact the system, a low pass filter should be inserted between the vcc and pvcc pins, and a schottky barrier diode or snubber established between the sw and pgnd pins.
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 16 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet i/o equivalence ci rcuit fig.35 i/o equivalence circuit en ? en pin ? sw pin pv cc sw pv cc pv cc ith ? ith pin v cc ? vout pin pv cc bst ? bst pin pv cc sw vout
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 17 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet operational notes 1. absolute maximum ratings while utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. if broken, short - mode or open - mode may not be identified. so i f it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowes t electrical potential in any operating conditions . 3. short - circuiting between terminals, and mismounting when mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. failure to do so may result in ic breakdown. shor t - circuiting due to foreign matters entered between output terminals, or between output and power supply or gnd may also cause breakdown. 4. thermal shutdown protection circuit thermal shutdown protection circuit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic. so, the ic the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 5. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impedance during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. when connecting to jigs in the inspection process, be sure to turn off the power supply before it is connected and removed. 6. input to ic terminals this is a monolithic ic with p + isolation between p - substrate and each element as illustrated below. this p - layer and the n - layer of each element form a p - n junction, and various parasitic element are formed. if a resistor is joined to a transistor terminal as shown in fig 3 6. p - n ju nction works as a parasitic diode if the following relationship is satisfied; gnd>terminal a (at resistor side), or gnd>terminal b (at transistor side); and if gnd>terminal b (at npn transistor side), a parasitic npn transistor is activated by n - layer o f other element adjacent to the above - mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. it is therefore req uested to take care not to use the device in such manner that the voltage lower than gnd (at p - substrate) may be applied to the input terminal, which may result in activation of parasitic elements. fig. 3 6 simplified structure of monorisic ic 7. ground wiring pattern if small - signal gnd and large - current gnd are provided , it will be recommended to separate the large - current gnd pattern from the small - signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of th e small - signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. 8. selection of inductor it is recommended to use an inductor with a series resistance element (dcr) 0.1 or less. especially, note that use of a high dcr inductor will cause an inductor loss, resulting in decreased output voltage. should this condition continue for a spe cified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched off. when using an inductor over 0.1 , be careful to ensure adequate margins for variation between external devices and this ic , including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within operation range. status of this document the japanese version of this document is formal s pecification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 18 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet ordering information b d 9 1 3 4 m u v - e 2 package muv: vqfn020v4040 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram vqfn020v4040 (top view) d 9 1 3 4 part number marking lot number 1pi n mark
www.rohm.com tsz02201 - 0j3j0aj00150 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 19 / 19 02.mar.2012 rev.001 tsz22111 ? 1 5 ? 001 bd9134muv data s heet revision history date revi sion changes 17.jan.2012 001 new release
datasheet d a t a s h e e t notice - rev.001 notice precaution for circuit design 1) the products are designed and produced for applicatio n in ordinary electronic equipment (av equipment, oa equipment, telecommunication equipment, home appliances, amusement equipment, etc.). if the products are to be used in devices requiring extremel y high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel contro llers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the rohm sales staff in advance. if product malfunctions may re sult in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits in the case of single-circuit failure 2) the products are designed for use in a standard environment and not in any spec ial environments. a pplication of the products in a special environment can deteriorate product per formance. accordingly, verification and confirmation of product performance, prior to use, is recomm ended if used under the following conditions: [a] use in various types of liquid, includin g water, oils, chemicals, and organic solvents [b] use outdoors where the products are exposed to direct sunlight, or in dusty places [c] use in places where the products are exposed to sea winds or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use in places where the products are exposed to static electricity or electromagnetic waves [e] use in proximity to heat-producing componen ts, plastic cords, or other flammable items [f] use involving sealing or coating the prod ucts with resin or other coating materials [g] use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] use of the products in places subject to dew condensation 3) the products are not radiation resistant. 4) verification and confirmation of performance characte ristics of products, after on- board mounting, is advised. 5) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 6) de-rate power dissipation (pd) depending on ambient temperature (ta). when used in sealed area, confirm the actual ambient temperature. 7) confirm that operation temper ature is within the specified range described in product specification. 8) failure induced under deviant condition from what def ined in the product specific ation cannot be guaranteed. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the remainder of fl ux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the company in advance. regarding precaution for mounting / circu it board design, please specially refe r to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) the application examples, their const ants, and other types of information cont ained herein are applicable only when the products are used in accordance with standard methods . therefore, if mass production is intended, sufficient consideration to external conditions must be made.
datasheet d a t a s h e e t notice - rev.001 precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution during manufacturing and st oring so that voltage exceeding product ma ximum rating won't be applied to products. please take special care under dry condition (e.g. grounding of human body / equipment / so lder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriorate if the products are stored in the following places: [a] where the products are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] where the temperature or humidity exceeds those recommended by the company [c] storage in direct sunshine or condensation [d] storage in high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding recommended storage time period . 3) store / transport cartons in the correct direction, whic h is indicated on a carton as a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a dry bag. precaution for product label qr code printed on rohm product label is only for internal us e, and please do not use at cust omer site. it might contain a internal part number that is inconsistent with an product part number. precaution for disposition when disposing products please dispose them properly with a industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under controlled goods prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. prohibitions regarding industrial property 1) information and data on products, including application exam ples, contained in these specifications are simply for reference; the company does not guarantee any industrial pr operty rights, intellectual property rights, or any other rights of a third party regarding this information or data. ac cordingly, the company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the us e of the products listed herein. 2) the company prohibits the purchaser of its products to exercise or use the in tellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the company, other than the right to use, sell, or dispose of the products.

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